| 型号 | 容量 | NAND Flash | 规范 | 封装 | 尺寸 | 工作温度 | |
|---|---|---|---|---|---|---|---|
| THGBMFG6C1LBAIL | 8GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11.5mmx13mmx0.8mm | -25°C - 85°C | |
| THGBMFG6C1LBAIT | 8GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11mmx10mmx0.8mm | -25°C - 85°C | |
| THGBMFG7C2LBAIL | 16GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11.5mmx13mmx0.8mm | -25°C - 85°C | |
| THGBMFG7C2LBAIW | 16GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11mmx10mmx1.0mm | -25°C - 85°C | |
| THGBMFG7C1LBAIL | 16GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11.5mmx13mmx0.8mm | -25°C - 85°C | |
| THGBMFG8C4LBAIR | 32GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11.5mmx13mmx1.0mm | -25°C - 85°C | |
| THGBMFG8C4LBAIW | 32GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11mmx10mmx1.0mm | -25°C - 85°C | |
| THGBMFG8C2LBAIL | 32GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11.5mmx13mmx0.8mm | -25°C - 85°C | |
| THGBMFG9C8LBAIG | 64GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11.5mmx13mmx1.2mm | -25°C - 85°C | |
| THGBMFG9C8LBAIX | 64GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11mmx10mmx1.2mm | -25°C - 85°C | |
| THGBMFG9C4LBAIR | 64GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11.5mmx13mmx1.0mm | -25°C - 85°C | |
| THGBMFT0CBLBAIS | 128GB | 东芝15nm Flash | eMMC 5.0 | 153Ball FBGA | 11.5mmx13mmx1.4mm | -25°C - 85°C |